Model name | S10 | S20 |
Board Size | With buffer unused | Min. L50 x W30mm to Max. L980 x W510mm | Min. L50 x W30mm to Max. L1,480 x W510mm |
With input or output buffers used | Min. L50 x W30mm to Max. L420 x W510mm | — |
With input and output buffers used | Min. L50 x W30mm to Max. L330 x W510mm | Min. L50 x W30mm to Max. L540 x W510mm |
With input and output buffers used | 0.4 - 5.0mm |
Placement accuracy A (μ+3σ) | CHIP ± 0.040mm |
Placement accuracy B (μ+3σ) | IC ± 0.025mm |
Placement angle | ± 180° |
Component height (Board thickness + component height) | 6-axis 6-theta head: Max. 35mm 12-axis 2-theta head: Max. 20mm |
Applicable Components | 0201-120mm x 90mm, BGA, CSP,Connectors, other odd-shaped components |
Component package | 8-56mm tape (F1/F2 Feeders), 8-88mm tape (F3 Electric Feeders), Stick, Tray |
Component types (8mm tape conversion) | Max. 90 types (8mm tape), 45 lanes x 2 | Max. 180 types (8mm tape), 45 lanes x 4 |
Transfer height | 900 ± 20mm |
Machine Dimensions | L1,250 x D1,770 x H1,420mm | L1,750 x D1,770 x H1,420mm |
Weight | Approx. 1,200kg | Approx. 1,500kg |